Corrosion behaviour of copper under chloride-containing thin electrolyte layer

Publication year: 2011
Source: Corrosion Science, In Press, Accepted Manuscript, Available online 13 June 2011

Xiaoning, Liao , Fahe, Cao , Liyun, Zheng , Wenjuan, Liu , Anna, Chen , …

The corrosion behaviour of copper under chloride-containing thin electrolyte layers (TEL) was investigated using electrochemical impedance spectroscopy (EIS), cathodic polarization, linear polarization, SEM/EDS and XRD. The results indicate that the copper corrosion rate increases as TEL thickness decreases during the initial stages. After 192 h of immersion, the corrosion rate of copper under TEL in this order: 300 > 402 > 199 > bulk solution > 101 μm. The corrosion behaviour is uniform under TEL, and pitting is the primary corrosion type in the bulk solution. A corrosion model of the behaviour of copper under chloride-containing TEL is proposed.

 Highlights: ► The corrosion behaviour of copper under chloride-containing thin electrolyte layers (TELs) of various thicknesses was investigated. ► During the initial stage, the copper corrosion rate under TELs increases with decreasing layer thickness. ► After long immersion times, the copper corrosion rate follows the order 300 μm>402 μm>199 μm> bulk solution >101 μm. ► The corrosion behaviour under the TELs is primarily uniform. ► A corrosion model of copper under chloride-containing TELs is proposed.